Spacecraft Electronics
Radiation-hardened onboard computers, processors, memory systems, and bus controllers for spacecraft control and data management
18 products · 3 featured
Overview
Spacecraft electronics support onboard computing, data handling, memory and communications. The catalog includes SoC processors, SiP computer modules, memory devices, bus controllers and SpaceOS. Electrical limits, radiation ratings and software support are device-specific.
Product Lineup
System-on-Chip (SoC) Series
- SoC2008: 32-bit on-chip system; request device-specific electrical and interface information.
- SoC2012: four SPARC V8 cores for onboard computing.
- SoC2016: LEON4 (SPARC V8) processor with DSP and floating-point processing.
Onboard Computer Modules
- SiP2113: Universal onboard computer module.
- SiP2115: Onboard computing and data management module.
- SiP6117M: Programmable signal processing module.
Memory & Storage
- XY8R512K40: Anti-radiation SRAM.
- XY28F256KV / XY28F256KLV: 32K×8-bit PROM variants.
- XY6664RH: 8K×8-bit radiation-resistant PROM.
Bus Controllers & Interfaces
- XY61580: 1553B bus controller.
- A1013Q: Universal four-port chip.
- XY50601: Synchronous rectifier buck switching power chip.
Operating System
- SpaceOS: Embedded real-time operating system; confirm board and processor support for the selected configuration.
Technical Specifications
| Parameter | SoC2008 | SoC2012 | SoC2016 |
|---|---|---|---|
| Architecture | 32-bit on-chip system | Four SPARC V8 cores | LEON4 (SPARC V8) + DSP |
| Processing performance | Request device data | Over 300 MIPS at 100 MHz | Over 800 MIPS at 200 MHz |
| Power | Confirm configuration | Confirm configuration | ≤3 W |
| Listed interfaces | Request interface documentation | 1553B / RS-422 | SpaceWire / 1553B / CAN / RS-422 |
| Flight status | Request supporting records | First flight in 2015 stated in product information | Development completed in 2016; first flight not specified |
Sources: SoC2012 product, SoC2016 product and technical reference. Development dates are not first-flight dates.
Frequently Asked Questions
What is the radiation tolerance of these processors?
The controller-series overview lists 300 krad for SoC2012. This is not a rating for all electronics. Request the applicable device revision, test conditions and radiation report for the selected processor or memory device.
How do the SoC2008, SoC2012, and SoC2016 compare?
SoC2008 is a 32-bit on-chip system. SoC2012 integrates four SPARC V8 cores. SoC2016 combines LEON4 with DSP processing. Compare clock conditions, workload, power and peripheral interfaces before selecting a device.
What operating system support is available?
SpaceOS is listed in the catalog. Confirm the supported processor, board-support package and toolchain for the required hardware and software version.
Can I use multiple processors in a single spacecraft?
Redundancy requires system-level design, fault detection and suitable interfaces. A catalog entry alone does not establish compatibility with a particular redundant architecture.
What development tools are provided?
Request available interface documents, development tools and evaluation options for the selected part through the contact form.
Integration Support
Check electrical levels, bus protocols, timing, package, temperature range and radiation requirements. Contact SolarWing with the selected part names and mission requirements.
Last updated:
Available products
18 products in Spacecraft Electronics
A1013Q Universal Four-Port Chip
- Process Technology
- 0.13 μm
- Dimensions (mm)
- 28 × 28 × 7
- Weight (g)
- 12
Microsatellite Integrated Electronics
- Model
- C-ICDE-DMR/C-2
- Technology
- SiP / SoC
- Flight Record
- First flight in 2019
NASSAT Computer
- Model
- C-GNCC-S-1
- Technology
- SiP / SoC
- Flight Record
- First flight in 2015
NASSAT Dual-Module Computer
- Model
- C-GNCC-DMR/C-7
- Technology
- SiP / SoC
- Flight Record
- First flight in 2018
Quad-Core SoC2012 32-bit Space Application On-Chip System
- Process Technology
- 0.13 μm
- Dimensions (mm)
- 37 × 37 × 3
- Weight (g)
- 12
SiP2113 Universal Onboard Computer Module
- Function
- Computing module functionality
- Packaging Technology
- Bare-die based packaging
- Dimensions (mm)
- 35 × 35 × 2
SiP2115 Universal Onboard Computer Module
- Function
- Computing module functionality
- Packaging Technology
- Bare-die based packaging
- Dimensions (mm)
- 37 × 37 × 5
SiP6117M Programmable Signal Processing Module
- Function
- Programmable signal processing SiP
- Packaging Technology
- Bare-die based packaging
- Dimensions (mm)
- 22 × 22 × 2
SoC2008 32-bit Space Application On-Chip System
The SoC2008 is a 32-bit on-chip system for satellite computing and spacecraft electronics. Request device-specific electrical specifications and interface documentation for the intended onboard application.
SoC2016 32-bit Space Application On-Chip System
- Processor Architecture
- LEON4 (SPARC V8) + DSP
- Processing Performance
- Over 800 MIPS / 200 MFLOPS at 200 MHz
- Power Consumption
- ≤ 3 W
SpaceOS Embedded Real-Time Operating System
- Scheduling Algorithm
- Priority-based fixed preemptive scheduling with time-slice round-robin support for tasks of the same priority
- Supported CPU Architectures
- SPARC and ARM
- Supported Number of Tasks
- Unlimited
The Core Components of the Micro-Satellite Controller
A series of highly integrated and miniaturized electronic system chips have been developed for micro- and nanosatellite control applications. These include the SoC2008 32-bit onboard application system chip, which has already been widely adopted in satellite electronic systems, and the SoC2012 32-bit onboard application system chip, designed for general onboard computing and attitude control with radiation tolerance up to 300 krad and a processing performance of 300 MIPS @ 100 MHz. The series also includes SoC2016 (LEON4 + DSP), SiP2113 general-purpose onboard computer module, and SiP2214 general-purpose onboard computing module with integrated data management functions. The SiP2115 general-purpose onboard computing module incorporates the A1013Q chip and serves as a typical onboard computer module for micro- and nanosatellites.
XY28F256KLV (3.3V) 32K×8bit Anti-Radiation PROM
- Process Technology
- 0.13 μm
- Dimensions (mm)
- 17.8 × 12.5 × 2.5
- Weight (g)
- 2.1
XY28F256KV (5V) 32K×8bit Anti-Radiation PROM
- Process Technology
- 0.13 μm
- Dimensions (mm)
- 17.8 × 12.5 × 2.5
- Weight (g)
- 2.1
XY50601 Radiation-Resistant Synchronous Rectifier Buck Switching Power Chip
- Function
- Switching Power Supply
- Process Technology
- 0.18 μm
- Dimensions (mm)
- 12.7 × 7.4 × 2.2
XY61580 Radiation-Resistant 1553B Bus Controller
- Process Technology
- 0.5 μm
- Dimensions (mm)
- 48 × 26
- Weight (g)
- < 15
XY6664RH Radiation-Resistant 8K×8bit PROM
- Process Technology
- 0.18 μm
- Dimensions (mm)
- 35.5 × 15.5 × 3
- Weight (g)
- 4.7
XY8R512K40/1M40 20M/40Mb Anti-Radiation SRAM
- Process Technology
- 0.13 μm
- Dimensions (mm)
- 29 × 29 × 3
- Capacity
- 512 K / 1 M × 40 bit
Compare variants
Side-by-side specifications for variants in this category. Values are taken directly from each product's datasheet.
| Parameter | XY28F256KLV (3.3V) 32K×8bit Anti-Radiation PROM | XY28F256KV (5V) 32K×8bit Anti-Radiation PROM |
|---|---|---|
| Process Technology | 0.13 μm | 0.13 μm |
| Dimensions (mm) | 17.8 × 12.5 × 2.5 | 17.8 × 12.5 × 2.5 |
| Weight (g) | 2.1 | 2.1 |
| Operating Temperature (°C) | −55 to +125 | −55 to +125 |
| Storage Temperature (°C) | −65 to +150 | −65 to +150 |
| Package Type | CFP28 | CFP28 |
| Quality Grade | CAST C | CAST C |
| Parameter | Quad-Core SoC2012 32-bit Space Application On-Chip System | SoC2016 32-bit Space Application On-Chip System |
|---|---|---|
| Process Technology | 0.13 μm | 0.13 μm |
| Dimensions (mm) | 37 × 37 × 3 | 41 × 41 × 10 |
| Weight (g) | 12 | 12 |
| Operating Temperature (°C) | −55 to +125 | −55 to +125 |
| Storage Temperature (°C) | −65 to +150 | −65 to +150 |
| Communication Interface | 1553B / RS-422 | SpaceWire / 1553B / CAN / RS-422 |
| Package Type | CQFP256 | CCGA1153 |
| Quality Grade | CAST C | CAST C |
| Parameter | SiP2113 Universal Onboard Computer Module | SiP2115 Universal Onboard Computer Module |
|---|---|---|
| Function | Computing module functionality | Computing module functionality |
| Packaging Technology | Bare-die based packaging | Bare-die based packaging |
| Dimensions (mm) | 35 × 35 × 2 | 37 × 37 × 5 |
| Weight (g) | 7 | 23 |
| Operating Temperature (°C) | −55 to +125 | −55 to +125 |
| Storage Temperature (°C) | −65 to +150 | −65 to +150 |
| Communication Interface | 1553B / RS-422 | 1553B / RS-422 |
| Package Type | BGA337 plastic package | CQFP256 ceramic package |
| Quality Grade | CAST C | CAST C |