Visual Overview
Technical Details
Comprehensive specifications and technical information
Quick Overview
The SiP2113 is a micro onboard computer module designed for aerospace embedded computing applications, utilizing SiP three-dimensional packaging technology. It integrates the SoC2008 processor, large-capacity SRAM data storage units, and high-capacity FLASH program storage units. Compared with conventional designs, the SiP2113 achieves more than 80% reduction in size, weight, and power consumption, while lowering cost by over 70%.
Key Specifications
| Parameter | Value |
|---|---|
| Function | Computing module functionality |
| Packaging Technology | Bare-die based packaging |
| Dimensions (mm) | 35 × 35 × 2 |
| Weight (g) | 7 |
| Operating Temperature (°C) | −55 to +125 |
| Storage Temperature (°C) | −65 to +150 |
| Communication Interface | 1553B / RS-422 |
| Package Type | BGA337 plastic package |
| Quality Grade | CAST C |
Key Features
- High functional integration with processor, memory, and bus controller.
- Miniaturized design — over 80% reduction in size, weight, and power consumption.
- Low cost — manufacturing cost reduced by over 70%.
- Fully independent and controllable, using domestically produced chips.
Applications
- Applied in microsatellites and embedded electronic systems, first flight in 2015.
Documentation & Resources
Frequently Asked Questions
Common questions about SiP2113 Universal Onboard Computer Module
What does the SiP2113 module integrate?
The SiP2113 integrates the SoC2008 processor, large-capacity SRAM data storage, and high-capacity FLASH program storage using SiP three-dimensional packaging. It provides 1553B and RS-422 interfaces.
How much size, weight, and power does the SiP2113 save?
Compared with conventional designs, the SiP2113 reduces size, weight, and power consumption by more than 80% and lowers cost by over 70%. It measures 35 x 35 x 2 mm and weighs about 7 g.
What package and quality grade does it use?
The module is supplied in a BGA337 plastic package at CAST C quality grade, using domestically produced chips. It operates from -55 to +125 C.
Does the SiP2113 have flight heritage?
Yes. The SiP2113 first flew in 2015 and is applied in microsatellites and embedded electronic systems.
