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Spacecraft Systems In Production

Microsatellite Integrated Electronics

The Microsatellite Integrated Electronics system is a highly integrated avionics solution developed with aerospace-grade components. It provides long service life, compact size, and high performance while maintaining cost efficiency and rapid development capability. The system combines platform control, data management, computation, and signal processing within a unified module, achieving high integration and reliability. It is designed to meet the requirements of low-cost, batch-produced, and fast-response satellite missions for microsatellites, nanosatellites, and constellation platforms.

Microsatellite Integrated Electronics

Key Specifications

Model
C-ICDE-DMR/C-2
Technology
SiP / SoC
Flight Record
First flight in 2019
Dimensions (mm)
293 × 203 × 212
Weight (kg)
3.5
Service Life (years)
15
Published: October 16, 2025 Last updated: October 18, 2025
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Comprehensive specifications and technical information

Quick Overview

The Microsatellite Integrated Electronics system is a highly integrated avionics solution developed with aerospace-grade components. It provides long service life, compact size, and high performance while maintaining cost efficiency and rapid development capability. The system combines platform control, data management, computation, and signal processing within a unified module, achieving high integration and reliability. It is designed to meet the requirements of low-cost, batch-produced, and fast-response satellite missions for microsatellites, nanosatellites, and constellation platforms.

Key Specifications

ParameterValue
ModelC-ICDE-DMR/C-2
TechnologySiP / SoC
Flight RecordFirst flight in 2019
Dimensions (mm)293 × 203 × 212
Weight (kg)3.5
Service Life (years)15
Operating Temperature (°C)−35 to +70
Storage Temperature (°C)−45 to +80
Communication Interface1553B Bus / RS422 / Synchronous Port
Power Supply20 V–40 V

Key Features

  • High performance — equipped with the high-performance SoC2008 processor.
  • High reliability — dual-module redundancy with full fault-tolerant management capability.
  • Compact structure — designed using the SiP2115 onboard computer module.
  • Lightweight — total weight approximately 3.5 kg.

Applications

  • Used in microsatellites, nanosatellites, and constellation platforms requiring high reliability and integration.

Documentation & Resources

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Frequently Asked Questions

Common questions about Microsatellite Integrated Electronics

What interfaces does the Microsatellite Integrated Electronics provide?

The system provides 1553B bus, RS-422, and synchronous port interfaces. It runs from a 20 V to 40 V supply and integrates platform control, data management, computation, and signal processing in one unit.

What is the service life of this integrated electronics system?

The Microsatellite Integrated Electronics (model C-ICDE-DMR/C-2) is designed for a 15-year service life and first flew in 2019. It uses dual-module redundancy with full fault-tolerant management for high reliability.

What is the mass and operating temperature range?

The unit weighs approximately 3.5 kg with dimensions of 293 x 203 x 212 mm. It operates from -35 to +70 C and can be stored from -45 to +80 C.

What processing hardware is used?

The system is built around the high-performance SoC2008 processor and the SiP2115 onboard computer module, and is intended for microsatellites, nanosatellites, and constellation platforms.

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