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SiP6117M Programmable Signal Processing Module

The SiP6117M Programmable Signal Processing Module is a system-level integrated product that combines FPGA, high-precision A/D, multi-channel A/D, and high-precision D/A modules. It offers high versatility, reliability, compact size, and low cost, making it widely applicable to optoelectronic and aerospace electronic systems such as fiber-optic gyroscopes and electromechanical platforms.

SiP6117M Programmable Signal Processing Module

Key Specifications

Function
Programmable signal processing SiP
Packaging Technology
Bare-die based packaging
Dimensions (mm)
22 × 22 × 2
Weight (g)
< 5
Operating Temperature (°C)
−40 to +85
Storage Temperature (°C)
−65 to +150
Published: October 16, 2025 Last updated: October 18, 2025
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Quick Overview

The SiP6117M Programmable Signal Processing Module is a system-level integrated product that combines FPGA, high-precision A/D, multi-channel A/D, and high-precision D/A modules. It offers high versatility, reliability, compact size, and low cost, making it widely applicable to optoelectronic and aerospace electronic systems such as fiber-optic gyroscopes and electromechanical platforms.

Key Specifications

ParameterValue
FunctionProgrammable signal processing SiP
Packaging TechnologyBare-die based packaging
Dimensions (mm)22 × 22 × 2
Weight (g)< 5
Operating Temperature (°C)−40 to +85
Storage Temperature (°C)−65 to +150
Package TypeBGA336
Quality GradeMilitary Grade

Key Features

  • High functional integration — integrates FPGA, configuration PROM, high-precision A/D, multi-channel A/D, high-precision D/A, and user I/O.
  • Miniaturized design — reduces size, weight, and power consumption by over 60%.
  • Low cost — overall cost reduction exceeding 65%.
  • High reliability — suitable for aerospace-grade applications.

Applications

  • Used in fiber-optic gyroscopes and electromechanical platforms requiring high-precision signal processing.

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Frequently Asked Questions

Common questions about SiP6117M Programmable Signal Processing Module

What does the SiP6117M module integrate?

It integrates an FPGA, configuration PROM, high-precision A/D, multi-channel A/D, high-precision D/A, and user I/O in a single system-in-package. It is delivered in a BGA336 package.

What are typical applications for the SiP6117M?

It is used in optoelectronic and aerospace electronic systems such as fiber-optic gyroscopes and electromechanical platforms that require high-precision signal processing.

How compact is the module and how much SWaP does it save?

The SiP6117M measures 22 x 22 x 2 mm and weighs under 5 g, reducing size, weight, and power consumption by over 60% and overall cost by more than 65%.

What temperature range and quality grade apply?

It operates from -40 to +85 C, stores from -65 to +150 C, and is rated to Military Grade for aerospace-grade applications.

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