Visual Overview
Technical Details
Comprehensive specifications and technical information
Quick Overview
The SoC2016 is the first domestically developed heterogeneous multi-core SoC designed for integrated satellite control and data processing applications. It combines a Cortex-A9 processor core with a DSP digital signal processor, floating-point processor, and multiple communication interfaces including 1553B, CAN, and SpaceWire buses, as well as a DMA controller. The chip achieves performance exceeding 1000 MIPS @ 500 MHz, with power consumption below 3 W, reaching advanced international standards.
Key Specifications
| Parameter | Value |
|---|---|
| Process Technology | 0.13 μm |
| Dimensions (mm) | 41 × 41 × 10 |
| Weight (g) | 12 |
| Operating Temperature (°C) | −55 to +125 |
| Storage Temperature (°C) | −65 to +150 |
| Communication Interface | SpaceWire / 1553B / CAN / RS-422 |
| Package Type | CCGA1153 |
| Quality Grade | CAST C |
Key Features
- High functional integration with Cortex-A9 and DSP cores, floating-point processor, and 1553B, CAN, and SpaceWire interfaces.
- High computational performance exceeding 1000 MIPS @ 500 MHz.
- Excellent radiation tolerance with triple modular redundancy and radiation-hardened unit design.
- Independently developed and fully controllable technology.
Applications
- Used in satellite control management and image data processing systems, research completed in 2016.
Documentation & Resources
Frequently Asked Questions
Common questions about SoC2016 32-bit Space Application On-Chip System
What processing architecture does the SoC2016 use?
The SoC2016 is a heterogeneous multi-core SoC combining a Cortex-A9 processor core with a DSP, a floating-point processor, and a DMA controller, achieving over 1000 MIPS at 500 MHz.
Which communication interfaces does the SoC2016 support?
It supports SpaceWire, 1553B, CAN, and RS-422 buses, making it suitable for integrated satellite control and image data processing.
What is the power consumption and package of the SoC2016?
Power consumption is below 3 W. The chip is supplied in a CCGA1153 package at CAST C grade, measuring 41 x 41 x 10 mm and weighing about 12 g.
How is the SoC2016 protected against radiation?
It uses triple modular redundancy and radiation-hardened unit design, and its development was completed in 2016 for satellite control management and image data processing systems.
