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Spacecraft Systems In Production

SiP2115 Universal Onboard Computer Module

The SiP2115 is a micro onboard computer module based on the SoC2008 processor core. It integrates large-capacity SRAM data storage units and FLASH program storage units. Compared with traditional designs, it achieves more than 80% reduction in size, weight, and power consumption, with cost reduced by over 60%. The SiP2115 adopts a ceramic package and domestically produced radiation-hardened chips, making it suitable for high-reliability and long-lifetime space missions.

SiP2115 Universal Onboard Computer Module

Key Specifications

Function
Computing module functionality
Packaging Technology
Bare-die based packaging
Dimensions (mm)
37 × 37 × 5
Weight (g)
23
Operating Temperature (°C)
−55 to +125
Storage Temperature (°C)
−65 to +150
Published: October 16, 2025 Last updated: October 18, 2025
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Comprehensive specifications and technical information

Quick Overview

The SiP2115 is a micro onboard computer module based on the SoC2008 processor core. It integrates large-capacity SRAM data storage units and FLASH program storage units. Compared with traditional designs, it achieves more than 80% reduction in size, weight, and power consumption, with cost reduced by over 60%. The SiP2115 adopts a ceramic package and domestically produced radiation-hardened chips, making it suitable for high-reliability and long-lifetime space missions.

Key Specifications

ParameterValue
FunctionComputing module functionality
Packaging TechnologyBare-die based packaging
Dimensions (mm)37 × 37 × 5
Weight (g)23
Operating Temperature (°C)−55 to +125
Storage Temperature (°C)−65 to +150
Communication Interface1553B / RS-422
Package TypeCQFP256 ceramic package
Quality GradeCAST C

Key Features

  • High functional integration with processor, memory, and bus controller.
  • Miniaturized design — more than 80% reduction in size, weight, and power consumption.
  • Cost-effective — manufacturing cost reduced by over 60%.
  • Fully independent and controllable, using domestically produced bare-die chips.

Applications

  • Used in microsatellites and embedded electronic systems, first flight in 2016.

Documentation & Resources

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Frequently Asked Questions

Common questions about SiP2115 Universal Onboard Computer Module

What is the SiP2115 module based on?

The SiP2115 is built around the SoC2008 processor core and integrates large-capacity SRAM data storage and FLASH program storage. It provides 1553B and RS-422 interfaces.

What package does the SiP2115 use and why?

It uses a CQFP256 ceramic package with domestically produced radiation-hardened chips, making it suitable for high-reliability, long-lifetime space missions. The module measures 37 x 37 x 5 mm and weighs about 23 g.

How much does the SiP2115 reduce size, weight, and power?

Compared with traditional designs it cuts size, weight, and power consumption by more than 80% and reduces cost by over 60%.

What temperature range and flight heritage does it have?

The SiP2115 operates from -55 to +125 C, stores from -65 to +150 C, and first flew in 2016.

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