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Spacecraft Systems In Production

High-Dynamic Nano Star Sensor

The nano star sensor determines satellite attitude by capturing and identifying stellar images.

High-Dynamic Nano Star Sensor

Key Specifications

Dimensions (mm)
50 × 50 × 89.4
Weight (g)
260
Mounting Material
2A12 T4
Operating Temperature (°C)
−30 to +50
Storage Temperature (°C)
−35 to +60
Communication Interface
RS-422 / CAN
Published: October 16, 2025 Last updated: February 9, 2026
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Technical Details

Comprehensive specifications and technical information

Quick Overview

The nano star sensor determines satellite attitude by capturing and identifying stellar images.

Key Specifications

ParameterValue
Dimensions (mm)50 × 50 × 89.4
Weight (g)260
Mounting Material2A12 T4
Operating Temperature (°C)−30 to +50
Storage Temperature (°C)−35 to +60
Communication InterfaceRS-422 / CAN

Key Features

  • Precision manufacturing with rapid batch production capability.
  • Miniaturized modular design with excellent thermal and structural integration.
  • Lightweight, compact, and low power consumption.
  • Advanced and stable technical performance indicators.

Applications

  • Used for attitude determination and high-dynamic tracking in nanosatellite and microsatellite platforms.

Documentation & Resources

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Frequently Asked Questions

Common questions about High-Dynamic Nano Star Sensor

How does the High-Dynamic Nano Star Sensor determine attitude?

It determines satellite attitude by capturing and identifying stellar images, supporting attitude determination and high-dynamic tracking on nanosatellite and microsatellite platforms.

Which interfaces does this star sensor provide?

The sensor communicates over RS-422 and CAN interfaces. It weighs about 260 g and measures 50 x 50 x 89.4 mm.

What temperature range does the sensor support?

It operates from -30 to +50 C and can be stored from -35 to +60 C, with a 2A12 T4 mounting structure.

What makes this star sensor suitable for batch production?

It uses precision manufacturing with rapid batch-production capability and a miniaturized modular design with strong thermal and structural integration.

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