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Comprehensive specifications and technical information
SiP2113 Universal Onboard Computer Module
Quick Overview
The SiP2113 is a micro onboard computer module designed for aerospace embedded computing applications, utilizing SiP three-dimensional packaging technology. It integrates the SoC2008 processor, large-capacity SRAM data storage units, and high-capacity FLASH program storage units. Compared with conventional designs, the SiP2113 achieves more than 80% reduction in size, weight, and power consumption, while lowering cost by over 70%.
Key Specifications
| Parameter | Value |
|---|---|
| Function | Computing module functionality |
| Packaging Technology | Bare-die based packaging |
| Dimensions (mm) | 35 × 35 × 2 |
| Weight (g) | 7 |
| Operating Temperature (°C) | −55 to +125 |
| Storage Temperature (°C) | −65 to +150 |
| Communication Interface | 1553B / RS-422 |
| Package Type | BGA337 plastic package |
| Quality Grade | CAST C |
Key Features
- High functional integration with processor, memory, and bus controller.
- Miniaturized design — over 80% reduction in size, weight, and power consumption.
- Low cost — manufacturing cost reduced by over 70%.
- Fully independent and controllable, using domestically produced chips.
Applications
- Applied in microsatellites and embedded electronic systems, first flight in 2015.
Related Products
- See related products in this series
Documentation & Resources
Frequently Asked Questions
Common questions about SiP2113 Universal Onboard Computer Module
What spacecraft platforms is this system compatible with?
This system is compatible with microsatellites, nanosatellites, CubeSats, and larger spacecraft platforms. It features modular design with standard interfaces for easy integration into various mission architectures and supports both commercial and scientific applications.
How does this system enhance spacecraft capabilities?
The system provides advanced functionality with reduced size, weight, and power consumption. It offers improved reliability through redundancy, radiation tolerance, and proven space-qualified components with extensive flight heritage.
What are the key performance specifications?
Key specifications include low power consumption, wide operating temperature range, high radiation tolerance (TID >100 krad), compact form factor, and long operational lifetime (>10 years). The system meets all relevant space qualification standards.
How is system integration and testing performed?
We provide comprehensive integration support including detailed interface specifications, test procedures, and simulation tools. All systems undergo thorough environmental testing, functional verification, and compatibility validation before delivery.
What documentation and support is available?
Complete technical documentation includes user manuals, interface control documents, test reports, and application notes. Our engineering team provides integration support, training, and ongoing technical assistance throughout the mission lifecycle.